1.0Great Lakes Semiconductor https://greatlakessemiconductor.comadminhttps://greatlakessemiconductor.com/index.php/author/kevin/rich600338<blockquote class="wp-embedded-content" data-secret="Gpyfx2BFbT"><a href="https://greatlakessemiconductor.com/">Home</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://greatlakessemiconductor.com/embed/#?secret=Gpyfx2BFbT" width="600" height="338" title="“Home” — Great Lakes Semiconductor " data-secret="Gpyfx2BFbT" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script> /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://greatlakessemiconductor.com/wp-includes/js/wp-embed.min.js </script> Powering North America’s Future, One Chip at a Time Great Lakes Semiconductor (GLS)  will be a fully-integrated semiconductor company focusing on developing world-class semiconductor fabrication facilities and technology park ecosystem aimed at addressing critical needs in North America’s semiconductor industry.  GLS initially will include: research, design and development of chips, chip sets, and other mems/sensor devices; workforce development; establish a pocket fab for prototype and small-lot production; and 3D packaging all at our new, state-of-the-art ChipForge™ Facilities. In collaboration with its strategic partners, such as Japan’s Neitas and Daikin, APES and AltaScient, GLS will focus on expanding and securing North America’s semiconductor supply chain. Our logo has true meaning. Consisting of five elements the logo is so much more than a traditional logo. We all have 5 major senses, symbolic of the sensors GLS will be primarily manufacturing in our early years of operation. Also in Japanese culture, there are 5 elements: Earth, Wind, Fire, Water and the Void. In Chinese and Korean cultures, the 5 elements are: Earth, Fire, Water, Metal and Wood. Five Core Elements of the Semiconductor Manufacturing Process: Wafer Fabrication (front-end processing) Lithography (patterning) Deposition & Etching (thin film processing) Interconnect and metallization Packaging and Testing (back-end processing) The Five Core Business Principles of Great Lakes Semiconductor: Innovation & integration – the smooth, rounded edges represent seamless integration of our semiconductor technologies with the United States’ high-tech industry. Collaboration & connectivity – reflecting the interconnected nature of semiconductor manufacturing and the broader supply-chain ecosystem especially in the technology park. Fluidity & Precision – inspired by the Great Lakes, the rounded edges could symbolize water, fluidity, and precision engineering in chip fabrication. Balance of tradition & future – the logo is a modern version of the maple leaf as an element of United States’ identity, while the rounded edges modernize and soften it for a forward- looking vision. Scalability & growth – the curves also suggest adaptability and growth., essential for a Class 1000 Pocket Fab as well as a major Class 1 cleanroom evolving from prototype to production. Finally, the five elements symbolize the five great personal influences on Dr. Thurston in conceptualizing and making this disruptive business a reality: E. Lawton Thurston, Jr., Yvonne Thurston, Jerry R. Junkins, Akira Ishikawa, and Dr. Chung-mou (Morris) Chang. In the News Commonwealth Magazine Taiwan’s Advanced Technological Capabilities Are a Central Focus of the Newly Initiated U.S. Section 301 Investigation Mar 16, 2026 Read More Commonwealth Magazine Taiwan’s $250 Billion Gamble: Lower Tariffs, Rising Risks for the Industrial Core Jan 21, 2026 Read More TechSoda Exclusive: TSMC’s Former General Counsel on Foundry Giant’s Strategic Logic Apr 27, 2025 Read Morehttps://greatlakessemiconductor.com/wp-content/uploads/2025/05/GLS-logo-TM-01-scaled.png2560700